In this work we describe the resistance changes due to Cu transport and precipitation during electromigration in 0.51 μm wide Al-0.5%Cu lines. A water-level, high resolution resistometric technique allowed us to detect significant resistance drops during the initial phase of the electromigration test. TEM microstructural analysis and SEM observations were also performed. Large CuAl2 aggregates were observed in the lines that underwent a high stressing current. The transport and coalescence of Cu atoms explains fairly well the observed resistance drops, that are likely to be clue to a decrease of the scattering events associated with tiny precipitates.
Resistance Changes due to Cu Transport and Precipitation during Electromigration in Submicrometric Al-0.5%Cu Lines
SCORZONI, Andrea;
1996
Abstract
In this work we describe the resistance changes due to Cu transport and precipitation during electromigration in 0.51 μm wide Al-0.5%Cu lines. A water-level, high resolution resistometric technique allowed us to detect significant resistance drops during the initial phase of the electromigration test. TEM microstructural analysis and SEM observations were also performed. Large CuAl2 aggregates were observed in the lines that underwent a high stressing current. The transport and coalescence of Cu atoms explains fairly well the observed resistance drops, that are likely to be clue to a decrease of the scattering events associated with tiny precipitates.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
