The finite difference time domain (FDTD) method is used to characterize packaged microstrip circuits, including the interconnections to coaxial lines. The results of isolated and coupled via-holes agree very well with the experiments, and show that package interaction phenomenon are accurately predicted

Simulation of interconnection and package interaction phenomena in MMIC's by FDTD

MEZZANOTTE, Paolo;ROSELLI, Luca;SORRENTINO, Roberto
1993

Abstract

The finite difference time domain (FDTD) method is used to characterize packaged microstrip circuits, including the interconnections to coaxial lines. The results of isolated and coupled via-holes agree very well with the experiments, and show that package interaction phenomenon are accurately predicted
1993
0780314271
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11391/141418
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