In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology combined with RF-MEMS technology and its emergence as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP’s very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe the fabrication process of LCP substrate, its characterization and properties upto W band, design of high Q inductors, SISO dual band filters with insertion loss as low as 2.4dB in L band and 1.8dB in C band respectively. MEMS-SOP switch fabrication and finally integration of C band wireless LAN (WLAN) module demonstrates the potential for compact, multiband and reconfigurable systems. This is the first complete report on the combination of LCP with RF-MEMS technology as a new approach towards the system-on-package (SOP) solutions for wireless communication applications.
RF and mm-Wave SOP Module Platform using LCP and RF MEMS Technologies
PALAZZARI, VALERIA;
2004
Abstract
In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology combined with RF-MEMS technology and its emergence as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP’s very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe the fabrication process of LCP substrate, its characterization and properties upto W band, design of high Q inductors, SISO dual band filters with insertion loss as low as 2.4dB in L band and 1.8dB in C band respectively. MEMS-SOP switch fabrication and finally integration of C band wireless LAN (WLAN) module demonstrates the potential for compact, multiband and reconfigurable systems. This is the first complete report on the combination of LCP with RF-MEMS technology as a new approach towards the system-on-package (SOP) solutions for wireless communication applications.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
