The knowledge of the actual temperature of a metal line is fundamental in electromigration tests. It depends on the feasibility of thermal resistance measurements on the test structures. This work deals with the typical problems associated with the evaluation of the thermal resistance of AlCu test structures. As a consequence of significant copper-precipitation-induced resistance drops during high temperature electrical and thermal characterisation of the lines, it is shown that the derived thermal resistance value is a decreasing function of the measurement elapsed time. Thermal characterisations performed at temperatures lower than those typically used] allowed us to overcome this kind of problem.

Evaluation of the Thermal Resistance of Al-Cu Electromigration Test Structures

SCORZONI, Andrea
2000

Abstract

The knowledge of the actual temperature of a metal line is fundamental in electromigration tests. It depends on the feasibility of thermal resistance measurements on the test structures. This work deals with the typical problems associated with the evaluation of the thermal resistance of AlCu test structures. As a consequence of significant copper-precipitation-induced resistance drops during high temperature electrical and thermal characterisation of the lines, it is shown that the derived thermal resistance value is a decreasing function of the measurement elapsed time. Thermal characterisations performed at temperatures lower than those typically used] allowed us to overcome this kind of problem.
2000
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11391/101652
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