In this paper the use of High Resolution Resistometric Techniques for early detection of electromigration strength of AlCu/TiN/Ti stripes is analyzed. Two lots of 4 μm wide lines were tested obtaining largely different lifetimes. When comparing the early resistance changes, at a first sight a similar behaviour was detected in the two lots. However, a more accurate inspection of the resistance evolution revealed the presence of two distinct and subsequent stages. Significant differences were detected during the first stage only, lasting a few hours. If confirmed by extensive experiments, this result could open new perspectives for the early detection of the metal quality.
Are High Resolution Resistometric Methods Really Useful for the Early Detection of Electromigration Damage?
SCORZONI, Andrea;
1997
Abstract
In this paper the use of High Resolution Resistometric Techniques for early detection of electromigration strength of AlCu/TiN/Ti stripes is analyzed. Two lots of 4 μm wide lines were tested obtaining largely different lifetimes. When comparing the early resistance changes, at a first sight a similar behaviour was detected in the two lots. However, a more accurate inspection of the resistance evolution revealed the presence of two distinct and subsequent stages. Significant differences were detected during the first stage only, lasting a few hours. If confirmed by extensive experiments, this result could open new perspectives for the early detection of the metal quality.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
