This paper reviews di erent known physical phenomena acting during electromigration, such as changes in the mechanical stress of the metal line, void growth and precipitation/dissolution of alloy elements (Cu, Si) and their e ects on early resistance changes. The superposition of all these phenomena is also discussed to describe the typical early resistance changes detected in Al-Cu lines of the present technology.
Early Electromigration Effects and Early Resistance Changes
SCORZONI, Andrea;
1999
Abstract
This paper reviews di erent known physical phenomena acting during electromigration, such as changes in the mechanical stress of the metal line, void growth and precipitation/dissolution of alloy elements (Cu, Si) and their e ects on early resistance changes. The superposition of all these phenomena is also discussed to describe the typical early resistance changes detected in Al-Cu lines of the present technology.File in questo prodotto:
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