Resistance degradation of thin film conductors is studied within a stochastic approach based on a random resistor network. Both defect generation and recovery are considered and assumed to depend on the stressing current. The main features of available experiments are well reproduced thus providing a unified interpretation of degradation processes and failure in terms of physical parameters.

A Stochastic Approach to Failure Analysis in Electromigration Phenomena

SCORZONI, Andrea
1999

Abstract

Resistance degradation of thin film conductors is studied within a stochastic approach based on a random resistor network. Both defect generation and recovery are considered and assumed to depend on the stressing current. The main features of available experiments are well reproduced thus providing a unified interpretation of degradation processes and failure in terms of physical parameters.
1999
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11391/101715
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