The FDTD method have been used to simulate two different kinds of MMIC package structures: first several simple microstrip discontinuities have been simulated with and without the metallic enclosure; then the method has been applied to investigate the behavior of high performance MMIC commercial package. Moreover, the behavior of a wide band Coplanar Waveguide (CPW) to slotline (SL) transition has been investigated. Specific features of the method are: the use of a matched source, graded mesh, and inclusion of a TEM feeding line to simulate the actual experimental setup. Computed results show excellent agreement with available experimental data.
Modeling of microwave packages and interconnections by FDTD
MEZZANOTTE, Paolo;MONGIARDO, Mauro;ROSELLI, Luca;SORRENTINO, Roberto
1994
Abstract
The FDTD method have been used to simulate two different kinds of MMIC package structures: first several simple microstrip discontinuities have been simulated with and without the metallic enclosure; then the method has been applied to investigate the behavior of high performance MMIC commercial package. Moreover, the behavior of a wide band Coplanar Waveguide (CPW) to slotline (SL) transition has been investigated. Specific features of the method are: the use of a matched source, graded mesh, and inclusion of a TEM feeding line to simulate the actual experimental setup. Computed results show excellent agreement with available experimental data.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
