In this paper, a graded mesh FDTD code running on the massive parallel computer DEC 12000 with 4K processors has been applied to analyzed various MMIC discontinuities enclosed in a metal package and fed by coaxial transitions. Observe that, in the present approach, the circuit and the package are analyzed as a whole. Moreover, also the effects of the feeding connectors have been thoroughly modeled. Since the package introduces resonances several different possibilities to choke off these resonances have been investigated. It is shown that the common practice of inserting a damping layer just below the lid is often not effective. In particular, the importance of placing damping layers also on the side walls is demonstrated.
Damping of package resonances in microwave integrated circuits: a FDTD analysis
MEZZANOTTE, Paolo;MONGIARDO, Mauro;ROSELLI, Luca;SORRENTINO, Roberto
1994
Abstract
In this paper, a graded mesh FDTD code running on the massive parallel computer DEC 12000 with 4K processors has been applied to analyzed various MMIC discontinuities enclosed in a metal package and fed by coaxial transitions. Observe that, in the present approach, the circuit and the package are analyzed as a whole. Moreover, also the effects of the feeding connectors have been thoroughly modeled. Since the package introduces resonances several different possibilities to choke off these resonances have been investigated. It is shown that the common practice of inserting a damping layer just below the lid is often not effective. In particular, the importance of placing damping layers also on the side walls is demonstrated.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
