3-D-Printing-Based Selective-Ink-Deposition Technique Enabling Complex Antenna and RF Structures for 5G Applications up to 6 GHz

This paper introduces a novel additivemanufacturing technique to obtain high-resolution selective-inkdeposition on complex 3-D objects, packages, and modules for 5G applications. The technique consists of embossing the desired pattern directly on the 3-D printed dielectric surface and then applying ink with a suitable tool. This approach is tested in combination with stereolithography 3-D printing technology to obtain selectively metallized 3-D circuits. In particular, the “clear” resin from FormLab is utilized for the 3-D printed dielectric, while the metallization is performed with silver nanoparticle ink from Suntronic. As a preliminary study, test samples containing lines with different widths are manufactured, demonstrating a pitch down to 135 μm and satisfactory sheet resistance of 0.011 /sq. (the electromagnetic characterization of the dielectric resin is reported in the Appendix). Then, two broadband multiport RF structures are developed to show the versatility of the proposed technology. First, an ultrawideband 3-D crossover, operating in the range 100 MHz–5 GHz, is conceived to test the suitability of the proposed technology to perform selective metallization on curved semienclosed areas. Then, the technology is applied to a multiple-input–multipleoutput (MIMO) antenna system, based on four proximity-fed annular slot antennas, arranged on the lateral sides of a cube and decoupled by introducing a cross-shaped structure in the interior of the cube. This circuit offers a broad range of metallization challenges, as it features embossed and engraved parts, high-resolution patterns (line widths down to 0.7 mm) and sharp edges.