The Isothermal Test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure.
Resistance Instability in Cu-damascene Structures during the Isothermal Electromigration Test
FICOLA, Antonio;SCORZONI, Andrea
2005
Abstract
The Isothermal Test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure.File in questo prodotto:
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