Electronics packaging evolution involves both architectural and technology considerations. In this paper, we present the design and measurements of Single-Input-Single-Output (SISO) dual-band filters operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, using the novel dual behavior resonators technique. The filters have been fabricated using Low Temperature Co-fired Ceramic (LTCC) and Liquid Crystal Polymer (LCP) multi-layer packaging technologies, enabling a low cost system-on-package (SOP) implementation. Finally an LTCC low-pass filter have been measured and cascaded to the dual-band in order to suppress high-frequency spurious response.
Design of WLAN Filters in LTCC and LCP System-on-Package Technologies
PALAZZARI, VALERIA;ROSELLI, Luca;ALIMENTI, Federico
2005
Abstract
Electronics packaging evolution involves both architectural and technology considerations. In this paper, we present the design and measurements of Single-Input-Single-Output (SISO) dual-band filters operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, using the novel dual behavior resonators technique. The filters have been fabricated using Low Temperature Co-fired Ceramic (LTCC) and Liquid Crystal Polymer (LCP) multi-layer packaging technologies, enabling a low cost system-on-package (SOP) implementation. Finally an LTCC low-pass filter have been measured and cascaded to the dual-band in order to suppress high-frequency spurious response.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
