Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF frontend module integration. LCP’s very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe main characteristics and real performance of LCP substrate, by means of several design examples. A Single-Input-Single-Output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, a dual polarization, dual frequency 2x1 antenna operating at 14 and 35 GHz, and a WLAN IEEE 802.11a compliant compact module (volume of 75x35x0.2 mm3) have been fabricated on LCP substrate, showing the great potential of the System-On-Package approach for 3D compact, multi-band and reconfigurable integrated RF and millimeter waves functions and modules.
Multi-band RF and mm-wave design solutions for integrated RF functions in Liquid Crystal Polymer System-On-Package technology
PALAZZARI, VALERIA;ROSELLI, Luca
2004
Abstract
Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF frontend module integration. LCP’s very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe main characteristics and real performance of LCP substrate, by means of several design examples. A Single-Input-Single-Output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, a dual polarization, dual frequency 2x1 antenna operating at 14 and 35 GHz, and a WLAN IEEE 802.11a compliant compact module (volume of 75x35x0.2 mm3) have been fabricated on LCP substrate, showing the great potential of the System-On-Package approach for 3D compact, multi-band and reconfigurable integrated RF and millimeter waves functions and modules.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
