Measurements, FEM Simulation and Spice Modeling of a Thermal Conductivity Detector

In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%.

Titolo: Measurements, FEM Simulation and Spice Modeling of a Thermal Conductivity Detector
Autori: 
RASTRELLO, FABIO
PLACIDI, Pisana
SCORZONI, Andrea
mostra contributor esterni 
Data di pubblicazione: 2011
Abstract: In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra ...Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%.
Handle: http://hdl.handle.net/11391/359099
ISBN: 9781424479344
Appare nelle tipologie:4.1 Contributo in Atti di convegno

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http://hdl.handle.net/11391/359099
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