In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%.
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Titolo: | Measurements, FEM Simulation and Spice Modeling of a Thermal Conductivity Detector |
Autori: | |
Data di pubblicazione: | 2011 |
Abstract: | In this paper we present a micromachined Thermal Conductivity Detector (TCD), based on the Ultra ...Low Power (ULP) technology. The device has been electrically characterized with different Helium gas flows, via a microfluidic experimental setup. Extraction of global thermo-electric parameters, exploited for the development of an electro-thermal Spice model, has been performed directly from the experimental measurements and from 3-D electro-thermal FEM simulations of the device. The resulting Spice model agrees very well with the measurements, with a maximum error less than 0.22%. |
Handle: | http://hdl.handle.net/11391/359099 |
ISBN: | 9781424479344 |
Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |