A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.
Quasi Static Analysis of Microstrip Bondwire Interconnects
ALIMENTI, Federico;SORRENTINO, Roberto
1995
Abstract
A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.File in questo prodotto:
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