A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.



Titolo: Quasi Static Analysis of Microstrip Bondwire Interconnects
Autori: 
ALIMENTI, Federico
SORRENTINO, Roberto
mostra contributor esterni 
Data di pubblicazione: 1995
Abstract: A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.
Handle: http://hdl.handle.net/11391/915227
ISBN: 0780325818
Appare nelle tipologie:4.1 Contributo in Atti di convegno

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