A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.
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Titolo: | Quasi Static Analysis of Microstrip Bondwire Interconnects |
Autori: | |
Data di pubblicazione: | 1995 |
Abstract: | A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The b...ondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate. |
Handle: | http://hdl.handle.net/11391/915227 |
ISBN: | 0780325818 |
Appare nelle tipologie: | 4.1 Contributo in Atti di convegno |
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