In this paper ohnfic contact electromigration is briefly reviewed. After a short introduction on the main contact failure mechanisms and technological solutions, the effect of contact scaling on electromigration is considered. Then, guidelines on test structures and lifetest set-up for contact electromigration studies are given, with particular reference to the thermal characterization needed to extract rehable data from lifetest experiments. Finally, the most recent experimental results obtained with both aluminum based metallizations and contacts making use of silicides or barrier layers are reviewed and compared.



Titolo: Ohmic contact electromigration
Autori: 
SCORZONI, Andrea
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Data di pubblicazione: 1992
Rivista: 
MICROELECTRONICS RELIABILITY  
Abstract: In this paper ohnfic contact electromigration is briefly reviewed. After a short introduction on the main contact failure mechanisms and technological solutions, the effect of contact scaling on electromigration is considered. Then, guidelines on test structures and lifetest set-up for contact electromigration studies are given, with particular reference to the thermal characterization needed to extract rehable data from lifetest experiments. Finally, the most recent experimental results obtained with both aluminum based metallizations and contacts making use of silicides or barrier layers are reviewed and compared.
Handle: http://hdl.handle.net/11391/915970
Appare nelle tipologie:1.1 Articolo in rivista

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